Glossary & Quick Reference
Every piece of jargon used in this course, alphabetical, with the shortest definition that's still accurate.
A
- Ablation: laser-driven removal of material via vaporization. Different from melting (heat-driven) or annealing (chemistry-driven).
- Anneal / Annealing: a chemical color change on metal surface caused by laser heating. No material removed; only oxide layer grown.
- Air assist: pressurized air directed at the kerf to clear smoke, debris, and slag during a cut.
- Anodized: aluminum surface treated with electrolytic oxide layer that holds dye. Lasers ablate the dye to reveal white aluminum oxide.
B
- BCG: Bolt Carrier Group (firearms). 8620 case-hardened steel, surface-mark only.
- BJJCZ / JCZ: galvo controller board found in OMTech and most fiber lasers. Lightburn talks to it via the Galvo edition.
- Bi-directional scan: fill engraves both directions of travel. Faster than uni-directional.
- Bounding box: smallest rectangle containing all graphics. Default frame mode.
C
- CerMark / TherMark: marking sprays (LMM-14 is the aerosol for metal). Bond a black mark to bare metal under laser heat.
- Cleanup pass: fast, low-power scan run between engrave passes to remove vaporized debris before it re-deposits.
- Cross-hatch: fill at one angle plus a second pass at +90°. Doubles density.
- Cutoff frequency: manufacturer-specified minimum frequency below which the controller derates power for source safety. Typically ~48 kHz on JPT MOPA.
D
- Defocus: intentionally raising or lowering the head off true focus. Spreads the beam, used for black-on-stainless.
- Depth map: grayscale image where pixel brightness = engrave depth. White = nearest, black = farthest.
- Dither: image rendering that simulates grays via patterns of black dots (Floyd-Steinberg, Jarvis, Stucki, Atkinson, etc.).
- DOF / Depth of Focus: Z range over which the beam stays effectively focused. ±0.4mm for 70mm lens, ±1.2mm for 150mm.
- DPI / Dots Per Inch: engrave resolution. 318 DPI = 0.08 mm interval; 1016 DPI = 0.025 mm.
F
- F-theta lens: flat-field galvo lens. Ensures focus stays consistent across the working area.
- Fill mode: Lightburn layer mode that hatches an enclosed shape. Different from Line (vector cut/score).
- Flood Fill: galvo travel-time optimization that minimizes blank-space jumps.
- Focus stick: physical gauge equal to the lens's focal distance. Place on part, lower head until contact, raise by stick offset.
- Frequency: pulses per second, in kHz. See Understanding Frequency.
G
- Galvo: galvanometer-driven mirror system that steers the beam. Replaces a moving gantry. Used in fiber lasers.
- Gantry: moving X/Y carriage that physically traverses the beam delivery. Used in CO2 lasers.
- Grayscale (image mode): Lightburn mode that modulates Power Min ↔ Power Max per-pixel by brightness.
H
- Hatch / Hatch interval: parallel lines that fill an area. Smaller interval = denser fill.
- HRC: Rockwell C hardness scale. Tenifer Glock slides ~68 HRC; 1911 carbon steel ~40 HRC.
- Hull frame: convex outline framing mode. Tighter than Bounds for irregular shapes.
J
- Jarvis (dither): Jarvis-Judice-Ninke error-diffusion dither. Smoothest gradients; community standard for fiber photo engraving.
- Job Origin (9-dot): Lightburn selector that maps the head's start position to a corner/edge/center of the design.
- Jump speed: speed of mirror travel between marks (galvo). Higher = faster overall job.
K
- Kerf: width of material removed by a cut. Beam diameter + thermal spread.
- kHz / Kilohertz: frequency unit. 50 kHz = 50,000 pulses/second.
L
- Line interval: distance between hatch lines (mm). Smaller = denser fill.
- Line mode: Lightburn layer mode that traces vector paths. Different from Fill (which hatches).
M
- MOPA: Master Oscillator Power Amplifier. Fiber laser type with adjustable pulse width (2-500 ns). Enables color annealing.
N
- Nanosecond / ns: billionth of a second. Q-pulse width unit.
O
- OD / Optical Density: laser glasses rating. OD 5+ for 1064nm fiber; CO2 needs OD 5+ for 10600nm. Wavelengths NOT interchangeable.
- Overcut: Line mode setting that extends a closed cut past its endpoint, burning through the join seam.
P
- Pass / Loops: number of times a layer repeats. Lightburn calls it "Number of Passes"; community calls it "loops."
- PMAG: Magpul polymer magazine. High-impact polymer; engraves with short pulses.
- Pulse width / Q-pulse: duration of each laser pulse, in ns. MOPA-only adjustable. Default 200 ns.
Q
- Q-pulse Width: see Pulse width.
- Q-switched: fiber laser type with FIXED pulse width (~80-140 ns). Cheaper than MOPA. No color annealing.
R
- Ramp test: focus calibration: engrave a thin line on a tilted part; sharpest portion = true focus.
- Relief / 3D engraving: depth-modulated engrave producing physical sculpted surface from a depth map.
- Ruida: DSP controller used in many gantry-style CO2 lasers (Thunder, Boss, Aeon, Cloudray, OMTech and more).
S
- Scan angle: direction of hatch lines in degrees. 0° = horizontal.
- Shovel layer: Lightburn vector technique for multi-level coin depth. Three layers: subject + shovel (recess) + background.
- Sub-layer: galvo-only Lightburn feature: up to 11 sub-tabs per layer with their own settings, run sequentially.
T
- TC / Time Constant: galvo-only delay fields (Laser On TC, Laser Off TC, End TC, Polygon TC). Mirror settling timing in microseconds.
- Tenifer: Glock's nitrided surface treatment. ~68 HRC; surface-mark only with fiber.
- Threshold: image mode: pure black/white cutoff at a brightness level. Sharp edges, no grays.
- Tool layer: Lightburn layer that doesn't output but is included in framing. Used for jig outlines.
W
- Wobble: galvo-only setting that traces tiny circles along a path. Increases dwell, widens kerf, used for cutting thin metal.
Z
- Z step / Z step per pass: Lightburn Line/Image setting that drops Z height between passes. Keeps focus on the working depth during deep engraves.